• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method of manufacturing a printed circuit board assembly, the method comprising the steps of: providing at least one flexible printed circuit board 1 comprising conductive regions 20; Providing a casting tool, preferably a spray or die casting tool, which comprises at least one receptacle for the at least one flexible printed circuit board 1 and at least one casting cavity for forming a heat sink 40; Inserting the flexible printed circuit board 1 into the receptacle of the casting tool; and injecting or introducing plastic into the casting tool, so that the cooling body 40 is formed directly on at least one side of the inserted flexible printed circuit board 1. The invention further relates to a printed circuit board arrangement and a lighting means.
    公开号:AT14685U1
    申请号:TGM22/2014U
    申请日:2014-01-22
    公开日:2016-04-15
    发明作者:Piere Angelo Ing Favarolo；Erich Ing Schwärzler
    申请人:Zumtobel Lighting Gmbh；
    IPC主号:
    专利说明:

    description
    FLEXIBLE CONDUCTOR PLATE WITH COOLING BODY
    1. FIELD OF THE INVENTION
    The present invention relates to a method for producing a printed circuit board assembly, and a (thereby produced) printed circuit board assembly and a Beleuch¬tungsmittel with such a printed circuit board assembly.
    2. BACKGROUND
    Various embodiments of flexible printed circuit boards, in particular for receiving light-emitting diodes, with conductive regions, such as strip conductors and connection pads for receiving light-emitting diodes, are known from the prior art. Such printed circuit boards are usually made from a plastic material which has one has correspondingly high flexibility, for example polyimide, polyethylene naphthalate, polyester or FR-4.
    However, these materials generally have only relatively low thermal conductivities, so that the heat generated by the light-emitting diodes can only be dissipated insufficiently by the printed circuit board material itself. Only through the conductive regions, which are usually formed from a copper alloy, and thus have a high Wärmeleitfä¬ ability, takes place a heat dissipation. However, this is not sufficient in practice to dissipate the heat from the light emitting diodes satisfactorily. This is problematic in so far as the luminous efficacy and the lifetime of a luminous device are strongly temperature-dependent. In practice, heat sinks are therefore arranged on the rear side of the flexible printed circuit board, which consist of materials with high heat conductivity, in order thereby to dissipate the heat as efficiently as possible from the light emitting diodes.
    Usually, the heatsinks consist of a good heat-conducting metal alloy based on copper or aluminum, and are glued or laminated to the back of the flexible printed circuit board. Such flexible printed circuit boards with glued or aufla¬minierten metallic heat sinks are known for example from the publications DE 202010 017 532 U1, DE 201 20 770 U1 and DE 199 22 176 A1.
    The attachment of the heat sink to the flexible circuit board by gluing or laminating thereby requires the implementation of several process steps, insbesonde¬re: applying suitable adhesive substances on the flexible circuit board or on the heat sink, applying suitable adhesion promoter, positioning the flexible printed circuit board on the heat sink, curing of glue, etc.
    In addition to this relatively high cost for connecting a flexible printed circuit board miteinem heatsink (among other things, due to the flexibility and shape of the flexible circuit board), in addition, the thermal coupling of the flexible circuit board with the heat sink achieved thereby is often not optimal, since the necessarily be provided adhesive, Adhesive and / or resin layers adversely affect the thermal coupling of the flexible circuit board to the heat sink.
    Based on this prior art, the present invention has the object to provide a method for producing a printed circuit board assembly with a flexible printed circuit board and a heat sink, in which the above-mentioned disadvantages of the prior art are eliminated or reduced.
    In particular, the present invention has the object bereitzustellenstellen a method by which a circuit board assembly with a flexible circuit board and a heat sink can be provided as simple as possible, without the in the state of
    Technique in connection with a gluing or laminating necessary Verfah¬rensschritte need to perform. In addition, optimum thermal coupling should be provided between the flexible circuit board and the heat sink.
    These and other objects, which will become apparent upon reading the following description or may be recognized by those skilled in the art, are achieved by the subject-matter of the independent claims. The dependent claims further form the central idea of the present invention in a particularly advantageous manner.
    3. DETAILED DESCRIPTION OF THE INVENTION
    The method according to the invention for producing a printed circuit board arrangement comprises the following steps: Providing at least one flexible printed circuit board comprising (electrically and / or thermally) conductive regions, such as conductor tracks and / or electrical contact region (for example Connection pads for light-emitting diodes); [0012] providing a casting tool (in particular an injection molding or pressure casting tool), which comprises at least one receptacle for the at least one flexible conductor plate and at least one casting cavity for forming a cooling body; - Inserting the flexible circuit board in the receptacle of the casting tool; and [0014] - injecting or introducing plastic into the casting tool, so that the cooling body is formed on at least one side of the inserted flexible printed circuit board.
    The inventive method therefore proposes to form the heat sink directly on one side, preferably at least on the back, the flexible printed circuit board by a (injection or pressure) casting process, so that there is a substantially integrally formed circuit board assembly results.
    By the proposed direct molding of the heat sink on the flexible printed circuit board or integrating the flexible circuit board directly in a thermally conductive plastic part, the necessary in the prior art process steps in connection with the sticking or laminating the flexible printed circuit board on the heat sink be avoided. The method according to the invention thus provides a considerably simpler, faster and thus less expensive possibility of providing a printed circuit board arrangement with a flexible printed circuit board and a heat sink.
    Consequently, there is no longer a need to provide necessary in connection with the sticking or laminating adhesive, Haftvermittler- and / or resin layers, so that, accordingly, no adverse effect on the thermi¬ coupling of the flexible circuit board with the Heatsink yields more. However, it should be understood that in some applications it may be advantageous to provide such layers.
    In addition to the advantages already mentioned above, thus also a much higher thermal coupling of the flexible circuit board can be achieved with the heat sink, as can be dispensed with necessarily in the prior art adhesive, Haftver¬mittler- and / or resin layers.
    Another advantage of the method according to the invention is that even flexible printed circuit boards, which are to take on a more complex shape, such as often used in automotive applications, can be easily provided (eg, back-injected) with a geometrically adapted heat sink to perform a function ¬kombination of platinum carrier with heat sink to form. In this way, cost-effective series parts can be manufactured.
    Preferably, the plastic comprises a filler for increasing the thermal
    Conductivity. As a filler for increasing the thermal conductivity of the heat sink, all materials come into consideration, which have a high thermal conductivity and can be added to the (thermoplastic) plastic. In particular, the following materials are particularly well suited as fillers for the plastic: copper, aluminum, graphite, carbon black, Al 2 O 3, AlN, BN, etc. Such heat sinks enable very good thermal properties, similar to those of alumina and germanium better than that of CEM-3 or FR-4 PCBs.
    In addition, it is possible to add the filler as required in different proportions of the plastic and thereby adapt the respective Wärme¬leitfähigkeit the heat sink to different conditions, such as beispiels¬weise to the resulting amount of heat or to the available Kühlkörper¬volumen , If, for example, only a limited volume is available for the heat sink, the thermal conductivity of the plastic and thus the heat removal can be increased by a higher filler input.
    Preferably, by the filler, which is added to the plastic, a thermal conductivity between 1 and 15 W / mK, preferably between 2 and 10 W / mK and more preferably between 4 and 6 W / mK set. In practice, it has been shown that for most applications, a thermal conductivity between 4 and 6W / mK is suitable.
    Preferably, the flexible printed circuit board is already equipped with electronic components, such as light emitting diodes, prior to insertion into the receptacle of the casting tool. Such a procedure is particularly advantageous in terms of manufacturing since the flexible printed circuit boards can be automatically equipped with light emitting diodes, for example, as long as the flexible printed circuit boards are not yet connected to a heat sink. This in turn leads to a considerable cost reduction and acceleration of the production process, since the light-emitting diodes do not have to be equipped manually or by an automation step that may still have to be developed.
    Due to the direct connection of the flexible circuit board with the vorgesehe¬nen or molded heat sink and the associated efficient Wärme¬abtransport beyond there is the possibility to equip the flexible circuit boards with so-called high-performance light-emitting diodes, where due The high Leis¬tungsaufnahme incur significant amounts of heat and are dissipated.
    High-performance light-emitting diodes or so-called high-power light-emitting diodes are to be understood here as meaning light-emitting diodes which have at least a power consumption of 300 mW, typically a power consumption between 1 and 3 W.
    As far as the conductive regions of the flexible printed circuit board, in particular conductor tracks and connection pads for light emitting diodes, do not extend through the entire cross section (thickness) of the flexible printed circuit board, the heat sink can also be designed as electrically conductive, since in this case the conductive regions have no direct contact with the heat sink. It should be noted in this regard that high filler loading of an electrically conductive material into the plastic may cause the heat sink to become electrically conductive.
    Preferably, however, the heat sink is electrically insulating, i. If necessary, a filler entry is selected which is insufficient to render a heat sink formed therewith electrically conductive.
    An electrically insulating heat sink is particularly advantageous if the conductive areas (eg, printed conductors and / or the connection pads) of the flexible printed circuit board at least partially extend continuously from the front to the back of the flexible circuit board, and thus the touch the heatsink on the back of the flexible printed circuit board.
    As already noted, the conductive areas of the flexible circuit board are usually formed of copper, i. of a thermally and electrically highly conductive material, so that the heat radiated by the light emitting diode can be discharged particularly efficiently via the conductive regions directly on the heat sink.
    Preferably, the flexible circuit board is formed from one of the following materials. For example, the flexible circuit board comprises essentially one of the following materials: polyethylene naphthalate, polyester and / or polyimide.
    In particular, it is advantageous if the flexible printed circuit board of polyimide (or a comparable thermoset polymer) is formed or consists essentially of polyimide. For polyimide has a particularly high Temperaturbestätigkeit, which is neces sary so that the flexible circuit board with the liquid, hot plastic in Berüh¬rung come without thereby the flexible circuit board is damaged or destroyed. Polyimide can be briefly exposed to temperatures of up to 400 ° C, without thereby damaging the material.
    For exact positioning of the flexible printed circuit board in the receptacle of the casting tool is in particular a fixation by a polyimide adhesive tape, which does not adversely affect the casting process and beyond the high Gusstempera¬turen survives. Alternatively, the flexible circuit board may be secured in the receptacle of the molding tool by means of a vacuum holding device, a clamping device or by means of an electrostatic holding device.
    The invention further relates to a printed circuit board assembly, comprising a flexible Lei¬terplatte with conductive areas and a directly with the flexible circuit board hen-hended or back-injected plastic heatsink. At least a part of the preferably electrically conductive regions is provided for thermal contacting of the flexible printed circuit board with the heat sink continuously from the front to the heat sink auf¬ pointing back of the flexible printed circuit board to be directly in contact with the Kühlkör¬per ,
    Furthermore, the invention relates to a lighting means, comprising a printed circuit board assembly according to the invention and also bulbs, such as light emitting diodes, which preferably on the side facing away from the heat sink side of the flexible printed circuit board with the conductive areas (ie, for example. Pads) are electrically contacted.
    4. DESCRIPTION OF A PREFERRED EMBODIMENT
    In the following, a detailed description of the figures is given, in which: FIG. 1 shows a schematic cross-sectional view of a flexible printed circuit board; Figure 2 is a plan view of a flexible conductor; FIG. 3 shows a rear side of the flexible printed conductor from FIG. 2; FIG. 4 shows the flexible printed circuit board from FIG. 1 equipped with light-emitting diodes (lighting means); FIG. 5 shows a printed circuit board arrangement according to the invention produced by a method according to the invention; FIG. 6 shows a schematic view of the printed circuit board arrangement (illumination means) according to the invention; and [0042] FIG. 7 shows a further embodiment of a printed circuit board according to the invention.
    Arrangement (lighting means) with 3D-shaped design.
    FIG. 1 shows a schematic cross-sectional view of a flexible printed circuit board 1 which, in the embodiment shown, has three connection pads for light-emitting diodes with corresponding conductor tracks 20.
    In the preferred embodiment shown, the flexible printed circuit board 1 comprises a carrier material 10 made of polyimide, which has the desired high flexibility and Temperaturbe¬ständigkeit.
    FIG. 2 shows a plan view of a flexible printed circuit board 1. The respective electrically (and / or thermally) conductive regions 20, here printed conductors and electrical contacts (for example connecting pads for light-emitting diodes) and thermal contacts are particularly well recognized. FIG. 3 shows the rear side of the flexible printed circuit board 1 shown in FIG. 2. It can be seen in FIG. 3 that the electrically and / or thermally conductive regions 20 (ie the predominantly thermal contacts) are at least partially continuous, i. from the front of the flexible printed circuit board 1 to the back of the flexible printed circuit board 1, are formed. Alternatively, further continuous conductive regions 20 can be provided in order to increase the thermal conductivity. "Conductive regions" are understood to mean, in particular, electrically conductive regions which predominantly (in particular the plated-through holes) also have a particularly good thermal conductivity.
    FIG. 4 shows the flexible printed circuit board 1 from FIG. 1 equipped with light-emitting diodes 30.
    As can be clearly seen in FIGS. 1 to 4, the printed conductors and connection pads 20 of the flexible printed circuit board 1 are at least partially continuous. The conductor tracks and connection pads 20 in this case consist of a copper alloy.
    FIG. 5 shows a schematic cross-sectional view of a printed circuit board arrangement according to the invention which has been produced by a method according to the invention. Diekzeigte printed circuit board assembly has electronic components, which are applied to the elektri¬schen contacts. In the case of light sources, for example light emitting diodes 30, as electronic components, the printed circuit board arrangement is also referred to as lighting means in the context of the invention.
    As can be clearly seen in Figure 5, a heat sink 40 made of plastic with a thermal conductivity enhancing filler directly contacts the back surface of the flexible circuit board 1, and thus directly the interconnects and pads 20 at least partially passing through the flexible circuit board. As a result, the heat occurring, for example, from the light-emitting diodes 30 is optimally guided through the printed conductors and connection pads 20 to the heat sink 40.
    To produce a printed circuit board arrangement as shown in FIG. 5, the procedure is as follows: First, either the flexible printed circuit board 1 shown in FIG. 1 without populated light-emitting diodes or the flexible printed circuit board 1 shown in FIG ¬oden 30 in a casting tool (preferably a spray or die casting tool), which has a special receptacle for the flexible circuit board 1, inserted.
    An attachment of the flexible printed circuit board 1 in the receptacle of the casting tool can be effected by means of an adhesive tape, for example based on polyimide. Alternatively, the flexible printed circuit board can also be fastened in the receptacle of the casting tool, for example, by means of a vacuum or vacuum holding device, a clamping device or by means of an electrostatic holding device.
    In the subsequent process step, (thermoplastic or thermosetting) plastic is introduced into the casting tool, which has a casting cavity for the heat sink 40 shown in FIG. 3; that is, for example, injected (during the injection molding process) or pressed in (in the die casting process).
    The injected or introduced plastic is preferably an aluminum-containing filler is added by the thermal conductivity of the heat sink 40 can be adjusted in dependence on the amount of filler. The plastic is introduced or injected into the casting mold or into the casting cavity depending on the amount of filler at a temperature between 250 and 400 ° C.
    By introducing or injecting the plastic and by the corresponding positioning of the flexible printed circuit board 1 in the casting tool, the cooling body 40 can thus be formed directly on the rear side of the flexible printed circuit board 1; Preferably, in such a way that it directly contacts the conductive regions 20 of the flexible printed circuit board 1 passing through the flexible printed circuit board 1.
    By the method according to the invention, it is thus possible to arrange a heat sink direkt¬bar on a flexible circuit board, without having to perform the necessary in the prior art process steps of sticking or lamination of the flexible Lei¬terplatte on a heat sink, and doing a To provide printed circuit board assembly, which allows efficient heat transfer from the light emitting diode to the heat sink.
    Figure 6 shows a schematic view of the printed circuit board assembly (lighting means) according to the invention with flexible printed circuit board 1, on which an electronic component (in the present case a light emitting diode 30) is electrically contacted via connection pads 22, wherein the conductive region further comprises a thermal (through) contacting 23 for effi¬zienten heat dissipation on the preferably back side of the flexible printed circuit board 1 vorgesehenen heat sink 40 has. The latter is preferably made of a thermally highly conductive plastic.
    Figure 7 shows another example of a printed circuit board arrangement (lighting means) according to the invention with a 3D-shaped configuration in which the light-emitting diodes 30 be¬stückte printed circuit board 1 in a complex arrangement provided in a simple manner with a correspondingly complex designed heat sink 40 or injected behind.
    It should be noted that the present invention is not limited to Lei terplatten arrangements for receiving light-emitting diodes or on the application in ei¬nem lighting means, but it is apparent to the skilled person that the vorliegendes invention can generally be used where flexible printed circuit boards are provided with ei¬nem heat sink. In other words, in applications where heat energy is to be dissipated by a flexible circuit board through a heat sink. The above-described embodiments can be combined with one another in any desired manner.
    权利要求:
    Claims (18)
    [1]
    Claims 1. A method of manufacturing a printed circuit board assembly, the method comprising the steps of: - providing at least one flexible printed circuit board (1) comprising conductive regions (20); - Providing a casting tool, preferably an injection or die casting tool, which comprises at least one receptacle for the at least one flexible printed circuit board (1) and at least one casting cavity for forming a cooling body (40); - Inserting the flexible printed circuit board (1) in the receptacle of the casting tool; and - introducing plastic into the casting tool so that the cooling body (40) is formed directly on at least one side of the inserted flexible printed circuit board (1).
    [2]
    2. The method of claim 1, wherein the plastic comprises a filler for increasing the thermal conductivity of the heat sink (40).
    [3]
    The method of claim 2, wherein the thermal conductivity enhancing filler comprises at least one of copper, aluminum, graphite, carbon black, Al 2 O 3, AlN, BN.
    [4]
    4. The method according to any one of the preceding claims, wherein the thermally conductive plastic has a thermal conductivity between 1 and 15 W / mK, preferably between 2 and 10 W / mK and more preferably between 4 and 6 W / mK.
    [5]
    5. The method according to any one of the preceding claims, wherein the flexible printed circuit board (1) is fitted with at least one light emitting diode (30) prior to insertion into the receptacle of the casting tool.
    [6]
    6. The method according to any one of the preceding claims, wherein the light-emitting diode (30) is a high-power light-emitting diode having a power consumption of at least 300 mW, preferably between 1 and 3 W.
    [7]
    A method according to any one of the preceding claims, wherein the heat sink (40) is formed on the back side of the flexible circuit board (1).
    [8]
    8. The method according to any one of the preceding claims, wherein the formed heat sink (40) is formed electrically insulating.
    [9]
    9. The method according to any one of the preceding claims, wherein at least a portion of the preferably electrically conductive regions (20) for thermal contacting of the flexible printed circuit board (1) continuously from the front to the heat sink (40) aufwei¬senden back of the flexible circuit board ( 1) is provided to be in direct contact with the Kühlkör¬per.
    [10]
    10. The method according to any one of the preceding claims, wherein the conductive regions (20), preferably conductor tracks (20) and / or electrical contacts, in particular An-connection pads (20) of the flexible printed circuit board (1), continuously from the front to the back of the flexible Printed circuit board (1) are formed and the conductor tracks (20) and / or the electrical contacts (20) the contact formed heat sink (40) kontaktie¬ren directly.
    [11]
    11. The method according to any one of the preceding claims, wherein the flexible printed circuit board (1) comprises at least one of the following materials: Polyethylennaphtalat, polyester, polyimide.
    [12]
    12. The method according to any one of the preceding claims, wherein the flexible printed circuit board (1) is fixed by means of an adhesive tape in the receptacle of the casting tool.
    [13]
    13. The method of claim 12, wherein the adhesive tape preferably comprises polyimide.
    [14]
    14. The method according to any one of the preceding claims, wherein the plastic with a temperature between 250 and 400 ° C, preferably between 280 and 380 ° C and more preferably between 300 and 320 ^ 0 introduced into the casting tool, in particular ein¬ injected.
    [15]
    15. Circuit board arrangement produced by a method according to one of claims 1 to 14.
    [16]
    16. Circuit board arrangement, comprising a flexible printed circuit board (1) with conductive regions (20) and one with the flexible printed circuit board (1) directly provided, in particular hinter¬ injected plastic heat sink (40).
    [17]
    17. A printed circuit board assembly according to claim 16, wherein at least a portion of the preferably electrically conductive regions (20) for thermal contacting of the flexible printed circuit board (1) is provided continuously from the front to the heat sink (40) having the rear side of the flexible printed circuit board (1), to be in direct contact with the heat sink in contact.
    [18]
    18. Lighting means, comprising a printed circuit board arrangement according to one of claims 15 to 17, further comprising light-emitting means, in particular light-emitting diodes (30), which preferably on the heat sink (40) facing away from the flexible printed circuit board (1) with the conductive regions (20). electrically contacted. 4 sheets of drawings
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    引用文献:
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    法律状态:
    2017-09-15| MM01| Lapse because of not paying annual fees|Effective date: 20170131 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102013226972.2A|DE102013226972A1|2013-12-20|2013-12-20|Flexible printed circuit board with heat sink|
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